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Enviromental Preservation
Solder paste recycling unit


Once solder paste used for the implementation of substrates is exposed to air, the solvent gradually evaporates over time, increasing the viscosity of the paste. Because the increased viscosity of solder causes misprints, the solder paste must be disposed after a certain period of time.
Meanwhile, this recycler, developed based on technology from Ricoh Microelectronics Co. Ltd. and Tottori University of Environmental Studies, which received an encouragement prize in the Circular Resource Techniques and Systems category from the Clean Center Japan (sponsored by METI), is an environmental preservation product that can recover 90% of waste solder paste and recycle it into bar-shaped solder ingots.


Operation flow


1. The solder paste is placed into the pot, where it is heated and separated at a controlled temperature. 2. The paste is allowed to rest to enable the dense medium to separate 3. The paste is cooled. Once it is solidified, the flux is removed. 4. After the solder bars drop due to their own weight, they are recovered.

Key features

  • The unit can drastically reduce factory waste (and waste disposal costs).
  • It can help reduce CO2 emissions during recovery/e-refinery processes.
  • The recovered solder bars can be used in soldering baths, etc., and reduce the necessity of purchasing new solder-bars.

General information


This solder paste recycler heats up solder paste in a dissolution bath and, after separating the flux and metal in a dense medium separation process, creates ingots/removes flux using the cooling temperature difference.
If 500 kg of solder paste are typcially disposed of in a year, approx. 1.3 million yen can be saved per year by using this recycler (based on trial calculations).


Dimensions: W750 x L550 x H1406 (mm)
Input load is 2.5 kg/time and a batch takes approx. 35-50 min.
A testing facility is located at our subcontracting company in Okayama prefecture.


Enviromental Preservation